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系列文章目录

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完善

• Functional block diagram，功能框图
• Key Features and Benefits，主要功能和优点
• Fabric 链路
• Multi-root

PCIe Retimer Overview Document Outline

KB90xx (Regli™) PCIe Retimer Overview Document Outline

1. Introduction

   • Overview of KB90xx (Regli™) PCIe Retimer family
   • Purpose and target applications

2. Kandou’s Unique Chiplet Approach

   • Single-silicon development for multiple products (x16, x8, x4 retimers)
   • Integration of Glasswing interface for low-power, low-latency chiplet communication

3. KB900x Product Overview

   • Key Features:
     • Compliance with PCIe Gen5/CXL 2.0 standards
     • Low latency (~10ns), insertion loss compensation (up to 36dB@16GHz)
     • Dynamic lane skew compensation, automatic offset calibration
     • Support for L1PM substates, on-chip diagnostics (eye scope, BER monitors, logic analyzer)
   • Voltage Flexibility:
     • PWR_1 (VDD_IO): 1.8V
     • PWR_2 (VDD_CORE): 0.9V
     • PWR_12 (VDD_PHY): 1.8V (Regular) or 1.2V/1.5V (Power Saving Mode)
   • Packaging Options:
     • KB9003 (x16): 354-ball BGA (8.9mm×22.8mm)
     • KB9002 (x8): 332-ball BGA (8.5mm×13.4mm)
     • KB9001 (x4): 146-ball BGA (5.5mm×10mm)

4. KB900x Product Family Comparison (NDA Required)

   Feature	KB9003	KB9002	KB9001
   PCIe Lanes	16 (Bidir)	8 (Bidir)	4 (Bidir)
   CXL Support	CXL 1.0/2.0	CXL 1.0/2.0	CXL 1.0/2.0
   Insertion Loss Comp.	Rx: 36dB@16GHz	Same as KB9003	Same as KB9003
   Power Consumption	14.7W	7.4W	3.7W
   Availability	ES: Now	CS: May 2024	CS: Q1 2025

5. KB900x Functional Block Diagram

   • Integration of AC coupling capacitors (220nF)
   • MCU with EEPROM/SPI Flash boot options
   • 100MHz HCSL clock source for PCIe reference clocks

6. KB900x Key Features & Benefits

   • Co-design compatibility with Astera Labs
   • Dynamic channel loss compensation (up to 36dB)
   • Secure platform boot support
   • Integrated logic analyzer for real-time debugging
   • Power-saving modes (1.2V/1.5V supply)

7. KB900x Software Overview

   • Besso GUI for advanced debugging features
   • Remote diagnostics capabilities

8. KB900x Advanced Debug Features

   • Eye Scope & BER Monitors: Analyze signal integrity and bit error rates
   • RTSSM Analyzer: Track state transitions across all lanes
   • Logic Analyzer: Trigger on signals (rising/falling edges) for upstream/downstream debug
   • Link Training Widget: Visualize PCIe Gen1-Gen5 link speeds and states

9. KB900x Link Training States

   • States: INACTIVE (gray), FAILED (red), ACTIVE (blue), PASSED (green)
   • Components: Detect, Polling, Configuration, Recovery, Loopback, L0 (Operational)

10. KB9003 CEM (x16 Lane) Riser Card

    • Evaluation board for KB9003
    • USB-connected PC control via Besso app

11. Retimer Use Cases

    • Genoa-based interoperability testing
    • Ethernet SmartNIC (ConnectX) integration
    • MCIO AEC test configurations

12. PCIe TSSM Block Diagram

    • Illustrates link training states (LTSSM) and protocol awareness

13. KB900x Debugging Tools

    • Firmware update and version display
    • Temperature sensor monitoring
    • Register dump and soft/hard MCU reset
    • Logic analyzer trigger conditions (e.g., pl_ltssm = 0x10 for L0 state)

14. Conclusion & Support

    • Global technical assistance from Kandou’s AE/FAE teams
    • Accelerated time-to-market through co-design and prototyping support

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附录图表说明

• KB900x Functional Block Diagram: 展示芯片功能模块（AC电容、MCU、时钟源）。
• KB900x RTSSM Analyzer: 实时状态转换监控界面截图。
• KB900x Logic Analyzer: 触发条件配置与信号采样界面示例。

Switch 维度

• Part Number, 部件编号
• PCI-Sig Base Spec, PCI-SIG 规范版本
• Lanes，通道数
• Port Count，端口数量
• Product Brief，产品简介
• ACS/ARI，访问控制服务/高级可扩展接口
• DMA，直接内存访问
• Dual/Multi Cast，单播/多播
• Latency，延迟
• Multi-Root/Multi-Host，多根/多主机
• Non-Transparency，非透明性
• Packaging Size，封装尺寸
• Power Typ. ，典型功耗
• Read Pacing，读取速率控制
• Virtual Channels，虚拟通道

BroadCom

ExpressFabric Switch and Retimer Solutions

博通PCIe Switch-学习笔记

MicroChip

Switchtec™ PCIe® Switches

Asmedia 祥硕

PCIe Switch

Cyan

其他

NVMe All Flash Array (AFA) systems

青芯说，国内现在他们的 PCIe4 Switch 用的最多的是 Storage RAID 卡（下行多个x4，上行一般是x8或者x16），和 GPU的一卡双芯（上行X16，两个下行X16）

全球PCIe交换芯片（PCIe Switch）核心厂商包括Broadcom、Microchip和Texas Instruments等，前三大厂商占有全球大约80%的份额。亚太是最大的市场，占有大约75%的份额。产品类型而言，PCIe 3.0是最大的细分，占有大约47%的份额。就下游来说，企业级是最大的下游领域，占有约45%的份额。

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AI产业笔记（二）：存算一体和PCIe SW芯片

1. Balance 拓扑：每个CPU下连接1个PCIe SW芯片，每个PCIe SW芯片最多可以连接5张GPU。远端GPU P2P通信受限于CPU间的UPI通信瓶颈，比较适用于VDI、公有云、AI训练等场景，属目前市场主流拓扑。

2. Common 拓扑：CPU0下连接2个PCIe SW芯片，每个PCIe SW芯片连接4张GPU。远端GPU通信无需跨CPU通信，GPU P2P吞吐量高。适合CPU参与较多任务的P2P通信密集训练算法模型，如Resnet 101/50。

3. Cascade 拓扑：CPU0 直连1个 PCIe SW芯片，此PCIe SW芯片与另一个PCIe SW芯片互联，每个PCIe SW芯片下面连接 4 张 GPU。Switch 芯片互联提供最强的 GPU P2P 通信，但CPU到GPU吞吐量小。适合CPU参与较少任务的P2P参数密集型训练算法模型如VGG-16。

4. 双上行拓扑：每个CPU下连接一个PCIe SW芯片，每个PCIe SW芯片连接4张GPU。CPU利用率最大化，提供最大上行链路带宽（2个x16的速率），但远端GPU P2P通信受限于CPU间的UPI通信瓶颈，适用于VDI、公有云、AI训练等场景。